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The Utis eSORBA DC series is a newly developed product offering specifically engineered to simplify processing and provide cost reduction. These benefits are the result of combining Utis eSORBA foam with a pressure-sensitive adhesive layer which allows customers to eliminate extra lamination steps.

This innovation enables higher compressibility than traditional laminated adhesive constructions to help designers ensure proper sealing and gap filling in ultra-thin device applications.

Currently the eSORBA DC Series is available for the SRP family of products


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MSDS

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PDFSRP-DC/DA MSDSEnglish110 KB

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